Your Link Between Data and Decision

 

   

 

  • Shape Matching

  • Correlation

  •  High Volume Testing

 
Neil Hubble from Akrometrix at the APEX show 2014 
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Services

Akrometrix offers fast, flexible and accurate results for testing: TherMoire by Akrometrix

  • Flatness, warpage and coplanarity of PCBs, substrates, ICs and package samples over a temperature profile such as reflow or thermal cycling.
  • For in-plane deformation (strain) measurement and CTE measurement; and
  • For form factors down to 2 mm and up to 600mm.

Akrometrix' flatness characterization and analysis solutions provide real-time data acquisition during dynamic temperature profiling with a temperature testing range from -55 C to 300 C. 

Furthermore, Akrometrix provides high volume inspection for flatness of PCBs, substrates, packages, and boards at room temperature efficiently. Components can be inspected in JEDEC trays, Auer boats and custom part holders. 

Akrometrix encourages its clients and prospects to visit its Atlanta, Georgia testing facility to participate in the testing process and review the results in a customized data format consisting of 3D suface plots, 2D contour mapping, 2D diagonal plots, coplanarity tables, and displacement matrices to enable better understanding of the data. Our application engineers are always available for data interpretation. 

Sample Flatness Testing Applications:Warpage Measurment by Akrometrix

  • PCB/substrate characterization at temperature
  • Pb-Free processing implementation
  • Validation of Finite Element Modeling (FEM)
  • Supplier performance and conformity monitoring
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Machined component flatness checks

 

Services are available on a per part or project basis.

FEATURED PRODUCT

INTERFACE ANALYSIS

New software that enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together.

  • Die to Package Design
  • Package on Package
  • Package to PCB
  • Computer Modeling Validation
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Process Optimization

Using our systems can dramatically reduce the failure rate during reflow and can help to increase your revenue and yield.